Linear source apparatus, system and method of use

ABSTRACT

A linear evaporation apparatus, system and method including a conductance chamber including a linear output section configured to emit a linear source deposition flux therethrough, an evaporative vapor communication conduit including an evaporative vapor mixing chamber and a plurality of crucible-receiving apertures at distal ends from the evaporative vapor mixing chamber, wherein the evaporative vapor mixing chamber is in communication with the conductance chamber and configured to transmit the linear source deposition flux therethrough, and a plurality of crucibles, each of the plurality of crucibles corresponding to one of the plurality of crucible-receiving apertures at the distal ends from the evaporative vapor mixing chamber, each of the plurality of crucibles configured to hold a material and heat the material to a corresponding material evaporation temperature, each of the plurality of crucibles further including a vapor pressure activated lid configured to open at a predetermined material vapor pressure value generated by heating the crucibles to at least the corresponding material evaporation temperature.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of co-pending U.S. patent application Ser. No. 16/124,568, filed Sep. 7, 2018, entitled “Linear Source Apparatus, System, and Method of Use” (Attorney Docket: 6494-227US1), which claims the benefit of U.S. Provisional Application Ser. No. 62/568,609, filed Oct. 5, 2017, entitled “Linear Source with Mixed-Multiple Host or Host/Host OLED Evaporation” (Attorney Docket: 6494-227PR1), each of which is incorporated herein by reference. If there are any contradictions or inconsistencies in language between this application and one or more of the cases that have been incorporated by reference that might affect the interpretation of the claims in this case, the claims in this case should be interpreted to be consistent with the language in this case.

BACKGROUND Field of the Invention

The present invention relates to organic light emitting diodes (OLEDs). In particular, fabrication of devices using single source with multiple hosts or host/dopant system incorporated into a single linear evaporation source for uniform coatings.

Description of Prior Art

An OLED device typically includes a stack of thin layers formed on a substrate. A light-emitting layer of a luminescent organic solid, as well as adjacent semiconductor layers, is sandwiched between a cathode and an anode. The light-emitting layer may be selected from any of a multitude of fluorescent and phosphorescent organic solids. Any of the layers, and particularly the light-emitting layer, also referred to herein as the emissive layer or the organic emissive layer, may consist of multiple sublayers.

In a typical OLED display, either the cathode or the anode is transparent or semitransparent. The films may be formed by evaporation, spin casting, chemical self-assembly or any other appropriate polymer film-forming techniques. Thicknesses typically range from a few monolayers (i.e., a single, closely packed layer of atoms or molecules, perhaps as thin as one molecule), up to about 1 to 2,000 angstroms.

High resolution displays may include millions of pixels and sub-pixels that are individually addressed by the drive electronics. The pixels can be formed by patterning anode and depositing blanket organic layers to form a monochrome display or form RGB side by side direct patterned pixels. One of the methods for forming these layers are deposited by using single material linear sources bundled together. Unfortunately, this arrangement takes too much space and does not mix the vapor for mixed host/dopant or multiple host systems from multiple linear sources rather it deposits in layers, which is undesirable.

SUMMARY

It should be appreciated that this Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to be used to limit the scope of the claimed subject matter.

In one embodiment disclosed herein, a linear evaporation apparatus includes a conductance chamber including a linear output section configured to emit a linear source deposition flux therethrough, an evaporative vapor communication conduit having an evaporative vapor mixing chamber and a plurality of crucible-receiving apertures at distal ends from the evaporative vapor mixing chamber, wherein the evaporative vapor mixing chamber is in communication with the conductance chamber and configured to transmit the linear source deposition flux therethrough. The linear evaporation apparatus further includes a plurality of crucibles, where each of the plurality of crucibles corresponding to one of the plurality of crucible-receiving apertures at the distal ends from the evaporative vapor mixing chamber, each of the plurality of crucibles configured to hold a material and heat the material to a corresponding material evaporation temperature, and each of the plurality of crucibles further including a vapor pressure activated lid configured to open at a predetermined material vapor pressure value generated by heating the crucibles to at least the corresponding material evaporation temperature.

In another embodiment disclosed herein a linear evaporation system includes linear evaporation apparatus having a conductance chamber including a linear output section configured to emit a linear source deposition flux therethrough, an evaporative vapor communication conduit including an evaporative vapor mixing chamber and a plurality of crucible-receiving apertures at distal ends from the evaporative vapor mixing chamber, wherein the evaporative vapor mixing chamber is in communication with the conductance chamber. The linear evaporation apparatus further including a plurality of crucibles, each of the plurality of crucibles corresponding to one of the plurality of crucible-receiving apertures at the distal ends from the evaporative vapor mixing chamber, each of the plurality of crucibles configured to hold a material and heat the material to a corresponding material evaporation temperature, and each of the plurality of crucibles further including a vapor pressure activated lid configured to open at a predetermined material vapor pressure value generated by heating the crucibles to at least the corresponding material evaporation temperature. The linear evaporation system further including a conductance chamber heater, and at least one crucible heater configured to heat material in at least one crucible of the plurality of crucibles to a corresponding material evaporation temperature.

In another embodiment disclosed herein, a method of operating a linear evaporation apparatus, includes providing linear evaporation apparatus including a conductance chamber including a linear output section configured to emit a linear source deposition flux therethrough, an evaporative vapor communication conduit having an evaporative vapor mixing chamber and a plurality of crucible-receiving apertures at distal ends from the evaporative vapor mixing chamber, wherein the evaporative vapor mixing chamber is in communication with the conductance chamber. The linear evaporation apparatus further includes a plurality of crucibles, wherein each of the plurality of crucibles corresponding to one of the plurality of crucible-receiving apertures at the distal ends from the evaporative vapor mixing chamber, each of the plurality of crucibles configured to hold a material and heat the material to a corresponding material evaporation temperature, and each of the plurality of crucibles further including a vapor pressure activated lid configured to open at a predetermined material vapor pressure value generated by heating evaporative material in the crucibles to at least the corresponding material evaporation temperature.

The method of operating the linear evaporation apparatus further includes providing at least one crucible heater configured to heat material in the plurality of crucibles to corresponding material evaporation temperatures, heating a first material in a first crucible of the plurality of crucibles to a corresponding first material evaporation temperature, opening a first vapor pressure activated lid on the first crucible based on heating the first material beyond the corresponding first material evaporation temperature. The method further includes heating a second material in a second crucible of the plurality of crucibles to a corresponding second material evaporation temperature, opening a second vapor pressure activated lid on the second crucible based on heating the second material beyond the corresponding second material evaporation temperature, and mixing evaporated first material and evaporated second material in the evaporative vapor mixing chamber of the evaporative vapor communication conduit. The method further includes ejecting the mixed evaporated first material and evaporated second material from the conductance chamber through the linear output section as the linear source deposition flux.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The embodiments of the invention will be better understood from the following detailed description with reference to the drawings, which are not necessarily drawing to scale and in which:

FIG. 1 illustrates a perspective exploded view of the linear evaporative apparatus;

FIG. 2 illustrates a cross-section of line A-A in FIG. 1 of the linear evaporative apparatus;

FIG. 3 illustrates an alternative flow diagram of the cross-section of line A-A in FIG. 1 of the linear evaporative apparatus; and

FIGS. 4-5 illustrates a logic diagram of a method of operating a linear evaporative system of the embodiments illustrated in FIGS. 1-3.

DETAILED DESCRIPTION

To deposit uniform layers of the multiple mixed hosts and host/dopant layers using linear sources, a modified linear source is proposed which will be used for forming uniform thin film layers for an organic semiconductor device. The linear source will comprise of multiple crucibles for organic materials to be evaporated with one side of the crucible having an opening. A crucible lid is attached which opens under vapor pressure allowing the material from multiple sources into a mixing tube and also prevents the vapor of the evaporating material of entering into the crucible of non-evaporating crucible, the mixing tube opens into a conductance channel.

The crucibles are heated to increase temperature of the crucible to form vapor pressure. The vapor pressure from multiple crucibles is mixed inside the heated mixing tube, which then enters the heated conductance channel so that evaporated deposition material is ejected from the nozzles to form a deposition flux.

The disclosure describes a single point linear evaporation of multiple hosts or host/dopant deposition system as shown in FIG. 1. It is comprised of two or more crucibles with vapor pressure release lids, mixing tube, conductance channel comprising of an elongated chamber with a plurality of nozzles arranged in a linear array depositing mixed vapor onto the substrate. The disclosure improves the uniformity of the film deposited on the substrate and occupies less space than conventional bundled linear sources.

FIG. 1 illustrates a perspective exploded view of the linear evaporative apparatus 10, and FIG. 2 illustrates a cross-section of line A-A in FIG. 1 of the linear evaporative apparatus 10. The linear evaporation apparatus 10 includes a conductance chamber 12 and a linear output section 14 including a plurality of linear array apertures 16 disposed along a top surface. A heat source 18 may heat the conductance chamber 12 to provide thermal energy to the deposition flux as it is travels through the conductance chamber 12 and out the linear output section 14 to be deposited on an adjacent target substrate 60.

The linear evaporative apparatus 10 further includes a vapor communication conduit 20 having a centrally located evaporative vapor mixing chamber 22 in communication with the interior portion of the conductance chamber 12. The vapor communication conduit 20 further including a plurality of crucible-receiving apertures 24 disposed at distal ends of the vapor communication conduit 20. FIGS. 1-3 illustrate two crucible-receiving apertures 24 to receive a corresponding plurality of crucibles 30, however, there may be more than two crucible-receiving apertures 24 in communication with the evaporative vapor mixing chamber 22 depending on the total number of crucibles, i.e., the total number of difference evaporative materials to be heated within the crucibles to be combined to produce the deposition flux output from the linear output section 14.

As illustrated, a first crucible 40 includes a material vapor pressure lid 42 including a first pressure-activated biasing member 44 for opening the first material vapor pressure lid 42 when a first vapor pressure within the crucible is above a first predetermined vapor pressure when a first deposition material 46 is heated to a first evaporative vapor emitting temperature by a first heating source 48.

Likewise, a second crucible 50 includes a material vapor pressure lid 52 including a second pressure-activated biasing member 54 for opening the second material vapor pressure lid 52 when a second vapor pressure within the crucible is above a second predetermined vapor pressure when a second deposition material 56 is heated to a second evaporative vapor emitting temperature by a second heating source 58.

FIG. 3 illustrates an alternative flow diagram of evaporative material within the cross-section of line A-A in FIG. 1 of the linear evaporative apparatus. When the first heater 48 and second heater 58 heat the respective first material 46 in the first crucible 40 and second material 56 within the second crucible 50, an evaporative material vapor pressure is generated by the heated material. When the evaporative material vapor pressure of each respective material is greater than a spring biasing force supplied by the spring biasing members 44, 54 of each respective crucible 40, 50, the material vapor pressure lids 42, 52 independently open to allow evaporative material to flow 100 from the respective crucibles 40, 50 into the crucible-receiving apertures 24 of the vapor communication conduit 20 such that the evaporative material of each crucible flows 100 in the direction of the evaporative vapor mixing chamber 22. After the evaporative materials meet at the evaporative vapor mixing chamber 22, the mixed evaporative material 110 flows into and through conductance chamber 12 until the mixed evaporative material flows out of the linear output section 14 as a linear source deposition flux output 120.

In summary, the linear evaporation apparatus 10 includes a conductance chamber 12 including a linear output section 14 configured to emit a linear source deposition flux 120 therethrough. The linear evaporation apparatus 10 further includes an evaporative vapor communication conduit 20 including an evaporative vapor mixing chamber 22 and a plurality of crucible-receiving apertures 24 at distal ends from the evaporative vapor mixing chamber 22, wherein the evaporative vapor mixing chamber 22 is in communication with the conductance chamber 12 and configured to transmit the linear source deposition flux 120 therethrough.

The linear evaporation apparatus 10 further includes a plurality of crucibles 30 (e.g., 40 and 50), wherein each of the plurality of crucibles 30 corresponding to one of the plurality of crucible-receiving apertures 24 at the distal ends from the evaporative vapor mixing chamber 22. Each of the plurality of crucibles 30 are further configured to hold a material 46, 56 and heat (via heaters 48, 58) the material 46, 56 to a corresponding material evaporation temperature. Each of the plurality of crucibles further include a vapor pressure activated lid 42, 52 configured to open at a predetermined material vapor pressure value generated by heating the crucibles to at least the corresponding material evaporation temperature.

The linear evaporation apparatus further includes a heated conductance chamber 12 supplied by a heater 18.

The linear output section 14 may further include at least one linear array of apertures for outputting the linear source deposition flux 120 therethrough.

A first material 46 may be heated within a first of the plurality of crucibles 40 to a corresponding first material evaporation temperature. Likewise, a second material 56 may be heated within a second of the plurality crucibles 50 to a corresponding second material evaporation temperature. The vapor pressure activated lid 42, 52 for the corresponding first 40 and second 50 plurality of crucibles is configured to open after each material 46, 56 reaches the corresponding material evaporation temperatures.

Each vapor pressure activated lid 42, 52 may be configured to close at a crucible vapor pressure value at or below a predetermined material vapor pressure value.

A linear evaporation system as described herein includes linear evaporation apparatus 10 including a conductance chamber 12 including a linear output section 14 configured to emit a linear source deposition flux 120 therethrough, an evaporative vapor communication conduit 20 having an evaporative vapor mixing chamber 22 and a plurality of crucible-receiving apertures 24 at distal ends from the evaporative vapor mixing chamber 22, wherein the evaporative vapor mixing chamber 22 is in communication with the conductance chamber 12. The linear evaporation apparatus may further include a plurality of crucibles 30, where each of the plurality of crucibles 40, 50 corresponds to one of the plurality of crucible-receiving apertures 24 at the distal ends from the evaporative vapor mixing chamber 22, each of the plurality of crucibles 40, 50 configured to hold a material 46, 56 and heat the material to a corresponding material evaporation temperature, and each of the plurality of crucibles further including a vapor pressure activated lid 42, 52 configured to open at a predetermined material vapor pressure value generated by heating the crucibles 30 to at least the corresponding material evaporation temperature.

The linear evaporation system may further include a conductance chamber heater 18, and at least one crucible heater 48, 58 configured to heat material in at least one crucible of the plurality of crucibles to a corresponding material evaporation temperature.

The linear output section 14 of the linear evaporation system further comprises at least one linear array of apertures 14.

The linear evaporation system is configured to heat a first material e.g., 46, within a first of the plurality of crucibles 40 to a corresponding first material evaporation temperature, and heat a second material, e.g., 56, within a second of the plurality crucibles 50 to a corresponding second material evaporation temperature.

The linear evaporation apparatus system is configured to open the vapor pressure activated lids 42, 52 for the respective first and second of the plurality of crucibles 40, 50 after each material 46, 56 reaches the corresponding material evaporation temperature.

The linear evaporation apparatus system includes a spring biasing member 44, 54 for each vapor pressure activated lid 42, 52 configured to keep the vapor pressure activated lid in a closed position relative to the respective crucible 40, 50 when a crucible vapor pressure value is below the predetermined material vapor pressure value.

The linear evaporation apparatus system is further configured to close each vapor pressure activated lid 42, 52 at a crucible vapor pressure value at or below the predetermined material vapor pressure value.

FIGS. 4-5 illustrates a logic diagram of a method of operating a linear evaporative system of the embodiments illustrated in FIGS. 1-3.

FIGS. 4-5 illustrates a method of operating a linear evaporation apparatus, including providing 200 a linear evaporation apparatus, (as illustrated in FIGS. 1-3), including: a conductance chamber 12 including a linear output section 14 configured to emit a linear source deposition flux 120 therethrough; an evaporative vapor communication conduit 20 having an evaporative vapor mixing chamber 22 and a plurality of crucible-receiving apertures 24 at distal ends from the evaporative vapor mixing chamber 22, wherein the evaporative vapor mixing chamber 22 is in communication with the conductance chamber 12; and a plurality of crucibles 30, wherein each of the plurality of crucibles 30 corresponds to one of the plurality of crucible-receiving apertures 24 at the distal ends from the evaporative vapor mixing chamber 22, each of the plurality of crucibles 30 configured to hold a material 46, 56 and heat the material to a corresponding material evaporation temperature, and each of the plurality of crucibles 30 further including a vapor pressure activated lid 42, 52 configured to open at a predetermined material vapor pressure value generated by heating evaporative material 46, 56 in the crucibles to at least the corresponding material evaporation temperature.

The method further includes providing 202 at least one crucible heater configured to heat material in the plurality of crucibles to corresponding material evaporation temperatures.

The method further includes heating 204 a first material in a first crucible of the plurality of crucibles to a corresponding first material evaporation temperature and opening 206 a first vapor pressure activated lid on the first crucible based on heating the first material beyond the corresponding first material evaporation temperature.

The method further includes heating 208 a second material in a second crucible of the plurality of crucibles to a corresponding second material evaporation temperature and opening 210 a second vapor pressure activated lid on the second crucible based on heating the second material beyond the corresponding second material evaporation temperature.

The method further includes mixing 212 evaporated first material and evaporated second material in the evaporative vapor mixing chamber of the evaporative vapor communication conduit and ejecting 214 the mixed evaporated first material and evaporated second material from the conductance chamber through the linear output section as the linear source deposition flux.

The method further includes providing a conductance chamber heater.

The method further includes providing the linear output section with at least one linear array of apertures.

The method further includes providing each pressure activated lid with a spring biasing member configured to keep the vapor pressure activated lid in a closed position relative to the crucible when a crucible vapor pressure value is below the predetermined material vapor pressure value.

The method further causing the opening the first vapor pressure activated lid on the first crucible by a first crucible vapor pressure value being greater than a first force provided by a first spring biasing member on the first crucible, and causing the second vapor pressure activated lid on the second crucible by a second crucible vapor pressure value being greater than a second force provided by a second spring biasing member on the second crucible.

The method further includes closing at least one of the first or second pressure activated lids when at crucible vapor pressure value falls below the predetermined material vapor pressure value.

The advantages of linear evaporation apparatus, system and method of operation thereof to deposit a linear source deposition flux on a substrate provides uniform coatings of multiple hosts and host/dopant organic layers on the substrate and a total space saving of the apparatus in the fabrication/deposition environment.

With respect to the above description then, it is to be realized that the optimum dimensional relationships for the parts of the disclosure, to include variations in size, materials, shape, form, function and manner of operation, assembly and use, are deemed readily apparent and obvious to one skilled in the art, and all equivalent relationships to those illustrated in the drawings and described in the specification are intended to be encompassed by the present disclosure. 

1-14. (canceled)
 15. A method of operating a linear evaporation apparatus, comprising: (1) providing the linear evaporation apparatus such that it includes: (i) a conductance chamber including a linear output section configured to emit a linear source deposition flux therethrough; (ii) an evaporative vapor communication conduit comprising an evaporative vapor mixing chamber and a plurality of crucible-receiving apertures at distal ends from the evaporative vapor mixing chamber, wherein the evaporative vapor mixing chamber is in communication with the conductance chamber; and (iii) a plurality of crucibles, each of the plurality of crucibles corresponding to one of the plurality of crucible-receiving apertures at the distal ends from the vapor mixing chamber, each of the plurality of crucibles configured to hold a material and heat the material to a corresponding material evaporation temperature, and each of the plurality of crucibles further including (a) a vapor pressure activated lid configured to open at a predetermined material vapor pressure value generated by heating evaporative material in the crucibles to at least the corresponding material evaporation temperature and (b) a spring biasing member configured to keep the vapor pressure activated lid in a closed position relative to the crucible when the material vapor pressure is less than the predetermined material vapor pressure value; (2) providing at least one crucible heater configured to heat material in the plurality of crucibles to corresponding material evaporation temperatures; (3) heating a first material in a first crucible of the plurality of crucibles to a corresponding first material evaporation temperature; (4) opening a first vapor pressure activated lid on the first crucible based on heating the first material beyond the corresponding first material evaporation temperature; (5) heating a second material in a second crucible of the plurality of crucibles to a corresponding second material evaporation temperature; (6) opening a second vapor pressure activated lid on the second crucible based on heating the second material beyond the corresponding second material evaporation temperature; (7) mixing evaporated first material and evaporated second material in the evaporative vapor mixing chamber of the evaporative vapor communication conduit; and (8) ejecting the mixed evaporated first material and evaporated second material from the conductance chamber through the linear output section as the linear source deposition flux.
 16. The method of operating a linear evaporation apparatus according to claim 15, further comprising providing a conductance chamber heater.
 17. The method of operating a linear evaporation apparatus according to claim 15, the method further comprising providing the linear output section with at least one linear array of apertures.
 18. (canceled)
 19. The method of operating a linear evaporation apparatus according to claim 15, wherein the opening the first vapor pressure activated lid on the first crucible is caused by a first crucible vapor pressure value being greater than a first force provided by a first spring biasing member on the first crucible, and wherein opening the second vapor pressure activated lid on the second crucible is caused by a second crucible vapor pressure value being greater than a second force provided by a second spring biasing member on the second crucible.
 20. The method of operating a linear evaporation apparatus according to claim 15, the method further comprising closing at least one of the first or second pressure activated lids when at crucible vapor pressure value falls below the predetermined material vapor pressure value.
 21. A method of operating a linear evaporation apparatus, the method comprising: vaporizing a first material to a first vapor pressure that exceeds a first predetermined material vapor pressure, wherein the first material is located in a first crucible that includes; a first vapor pressure activated lid; and a first spring biasing member configured to keep the first vapor pressure activated lid in a closed position relative to the first crucible when the first vapor pressure is at or below the first predetermined material vapor pressure; vaporizing a second material to a second vapor pressure that exceeds a second predetermined material vapor pressure, wherein the second material is located in a second crucible that includes; a second vapor pressure activated lid; and a second spring biasing member configured to keep the second vapor pressure activated lid in a closed position relative to the second crucible when the second vapor pressure is at or below the second predetermined material vapor pressure; mixing the vaporized first material and vaporized second material in an evaporative vapor mixing chamber to form a mixed evaporated material; and emitting a linear source deposition flux out of a linear output section that includes a plurality of apertures, wherein the linear source deposition flux includes the mixed evaporated material.
 22. The method of claim 21 wherein at least one of the first and second materials is an organic light-emitting material.
 23. The method of claim 21 further comprising depositing at least a portion of the linear source deposition flux on a surface of a substrate.
 24. The method of claim 23 further comprising forming a uniform layer comprising a mixture of the first and second materials on the surface.
 25. The method of claim 21 further comprising heating a conductance chamber that is configured to convey the mixed evaporated material from the evaporative vapor mixing chamber to the plurality of apertures.
 26. The method of claim 21 wherein the plurality of apertures is arranged in a linear array.
 27. The method of claim 21 further comprising: reducing the first vapor pressure to a value that is at or below the first predetermined material vapor pressure; and reducing the second vapor pressure to a value that is at or below the second predetermined material vapor pressure.
 28. A method of operating a linear evaporation apparatus, the method comprising: providing a plurality of crucibles that are fluidically coupled with an evaporative vapor mixing chamber, wherein each crucible is configured for a different material of a plurality of materials, and wherein each material of the plurality thereof has a corresponding predetermined material vapor pressure, and further wherein each crucible includes; a vapor pressure activated lid; and a spring biasing member configured to keep the vapor pressure activated lid in a closed position relative to its respective crucible when the vapor pressure in the crucible is at or below the corresponding predetermined material vapor pressure of its respective material of the plurality thereof; vaporizing each material of the plurality thereof to a vapor pressure that exceeds its corresponding predetermined material vapor pressure; mixing the vaporized materials in an evaporative vapor mixing chamber to form a mixed evaporated material; emitting a linear source deposition flux out of a linear output section that includes a plurality of apertures, wherein the linear source deposition flux includes the mixed evaporated material; and enabling deposition of at least a portion of the linear source deposition flux on a surface of a substrate.
 29. The method of claim 28 wherein at least one material of the plurality of materials is an organic light-emitting material.
 30. The method of claim 28 further comprising heating a conductance chamber that is configured to convey the mixed evaporated material from the evaporative vapor mixing chamber to the plurality of apertures.
 31. The method of claim 28 wherein the plurality of apertures is arranged in a linear array.
 32. The method of claim 28 further comprising reducing the vapor pressure of at least one material of the plurality thereof to a value that is at or below its corresponding predetermined material vapor pressure.
 33. The method of claim 28 further comprising reducing the vapor pressure of each material of the plurality thereof to a value that is at or below its corresponding predetermined material vapor pressure.
 34. The method of claim 28 further comprising forming a uniform layer comprising a mixture of the plurality of materials on the surface. 